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SalaryPosition Summary
Are you a highly skilled engineer with hands-on experience in packaging high-power-density semiconductor devices? Are you ready to take on an exciting challenge by applying your expertise to the creation of robust and scalable thermophotovoltaic (TPV) modules?
Your efforts will play a pivotal role in establishing the world's first TPV module assembly line, and you'll directly influence the development of a groundbreaking combined heat and power (CHP) long-duration energy storage product.
This is your chance to be part of something transformative, where your skills and passion will drive innovation and shape the future of sustainable energy solutions. Join us in making a difference and be at the forefront of cutting-edge technology.
Roles & Responsibilities
Contribute to TPV Module Development: Play a key role in the development of TPV modules capable of efficiently handling both electrical and thermal power, with a strong focus on durability under thermal cycling.
Assembly Process Optimization: Explore and evaluate various assembly process options and collaborate closely with design engineers to communicate findings and recommendations.
In-House Capabilities Development: Establish in-house capabilities and forge local partnerships for critical processes, including wafer handling, frame-mounting, dicing, die-bonding, screen-printing, and inspection utilizing coordinate-measuring machines (CMM).
Process Control: Develop comprehensive procedures and documentation for process control and optimization to ensure consistency and reliability in TPV module manufacturing.
Quality Assessment: Assess the quality of die attach through methods such as x-ray analysis and scanning-acoustic microscopy, differential scanning calorimetry, thermal resistance, electrical resistance, pull strength testing and thermal cycling.
Materials Management: Procure and maintain an inventory of materials required for all module assembly processes.
Key Qualifications
- Bachelor's degree in an engineering or technical field (e.g., mechanical engineering, electrical engineering, materials science, etc.), or equivalent.
- 4+ years of hands-on experience working with the assembly and/or packaging of semiconductor devices, including experience with processes such as frame-mounting, dicing, die-bonding, screen-printing, vacuum lamination and inspection utilizing coordinate-measuring machines (CMM).
- Exceptional attention to detail with strong verbal and written communication skills.
- Proficiency in modern software tools, including intra-office communication software and computer-aided design (CAD).
Additional Qualifications Desired
- Graduate degree in an engineering or technical field, or equivalent.
- Direct experience with packaging large-area, high-power-density device arrays for applications in integrated circuits, power converters, and power electronics.
- 4+ years of direct experience in the development, prototyping, and testing of optoelectronic devices.
- Experience with the assembly of photovoltaic (PV), concentrator photovoltaic (CPV), and/or thermophotovoltaic (TPV) modules.
- Knowledge of Quality Assurance principles and practices.
- Hands-on experience with wafer handling, frame-mounting, dicing, pick & place, die-bonding, and screen-printing processes.
Salary Range: $135,000 USD - $155,000 USD
Salary Basis: Annual
Total Rewards program includes a premium health benefits package with life and disability insurance, a 401K plan, a flexible spending account, industry leading paid time off policy, providing a flexible and inclusive holiday observance, as well as paid volunteer time off.
