Mechanical Engineer - Electronics Packaging (Code:dc)

Sr. Mechanical Engineer (Electronics Packaging)

Overview

The Electronics Packaging Mechanical Engineer is responsible for all aspects of the physical design and construction of ruggedized electronics and ruggedized electronics enclosures. The Engineer is responsible for designing products to meet customer's requirements as well as the cost targets established during the proposal stage.

Qualifications

· B.S. in Mechanical Engineering is required as a minimum (Advanced technical degree desirable)

· Mechanical engineer with Electronics packaging expertise, 5+ years’ experience

· Design experience with a variety of electronic packaging approaches for defense and aerospace applications including:

o Design for high shock and high vibration environments

o Design for challenging thermal conditions

o Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).

· Experience in Creo 3D CAD solid modeling and understanding of mechanical design

· Experience in performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.

· Experience with vibration, shock, and thermal fatigue calculations on electrical components.

· Experience designing to meet environmental testing per MIL-STD-810, DO-160

· Knowledge of machining operations, brazing and soldering.

· Knowledge of IPC, WHMA, and NASA specifications for PWBs, CCAs, wiring harnesses, and soldering.

· Knowledge of high voltage / altitude design practices at the board and box-level.

· Knowledgeable in the practical application of Geometric Dimensioning and Tolerancing