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Job Description:
The DMO General Manager is responsible for the safety, quality, output and cost of the Disaggregation Manufacturing Operation (DMO). Disaggregation is a critical emerging manufacturing capability enabling Intel's leadership products. The DMO GM leads Intel's worldwide advanced packaging foundry, Silicon Photonics development/manufacturing and certain CMOS foundry operations. In addition the group is responsible for the development of new interposer and bridge technologies. The DMO GM is an executive leadership role overseeing a staff of senior leaders and Vice Presidents and a large global organization.
Responsibilities include:
• Enabling InteI's IDM 2.0 strategy by leading a World-Class Advanced Packaging Foundry.
• Leading DMO to deliver new technologies, implement new business models, and support manufacturable & cost competitive foundry and systems.
• Active collaboration with technology development organizations to start-up and ramp new technologies to high volume and develop game-changing methodologies to enable significant operational improvements
• All operational aspects of DMO which operates advanced and high-volume facilities globally:
o Safety: DMO has a complex manufacturing environment with safety as the top priority
o People: Global org health, engagement, and development across multiple locations
o Quality: Delivering products that meet/exceed quality commitments to customers
o Cost: Manage a large operational budget with a goal to achieve world-class costs. Responsible for driving to and exceeding Product Margin goals.
o Output: Deliver consistent output on technologies and new product introductions to meet/exceed customer demand.
This role requires experiences in:
• Leading a global semiconductor manufacturing network and third-party suppliers, including experience in fab process, supply chain and materials management, and quality assurance
• Operational Excellence to identify and manage opportunities to improve safety, costs, output, quality/yields and other KPIs as well as expanding and optimizing the manufacturing network.
• Technical leadership in semiconductor manufacturing processes; breadth of experience across wafer fab and back-end processes (assembly and test), and tooling.
• Developing future innovation and/or emerging capabilities
• Collaborating, influencing and working across a highly matrixed organization with process development, supply chain, product/business and other engineering teams on joint roadmap development and other co-dependencies.
• Recognizing material, process-oriented and/or delivery issues which have a substantive impact on profitability.
• Articulating the implications of issues in financial terms and impact on P&L.
• Building relationships with key ecosystem partners and leveraging internal and external relationships- and working with Technology Development/R&D and Engineering, Finance, IT, HR and partner-suppliers to drive innovation and operational efficiency, as well as working with and understanding the operations of suppliers and construction.
Key leadership capabilities include:
• Leading large diverse global organizations
• Strong manufacturing and operational experience and leadership
• Strong execution and results focus
• Superior networking and influencing skills and the ability to build followership
• A combination of business acumen, organizational savvy, and technical expertise
• Ability to work cross-organizationally through matrix reporting structures to accomplish strategic objectives as well as organizational development goals
• Excellent business judgment & acumen, strategic vision, and negotiation skills
• Solid financial analysis skills, including creating and understanding different industry and Intel business unit models to optimize financial results for Intel
• Semiconductor foundry experience preferred
Qualifications:
Minimum Qualifications
Preferred Qualifications
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix, US, New Mexico, Albuquerque
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Job Description:
The DMO General Manager is responsible for the safety, quality, output and cost of the Disaggregation Manufacturing Operation (DMO). Disaggregation is a critical emerging manufacturing capability enabling Intel's leadership products. The DMO GM leads Intel's worldwide advanced packaging foundry, Silicon Photonics development/manufacturing and certain CMOS foundry operations. In addition the group is responsible for the development of new interposer and bridge technologies. The DMO GM is an executive leadership role overseeing a staff of senior leaders and Vice Presidents and a large global organization.
Responsibilities include:
• Enabling InteI's IDM 2.0 strategy by leading a World-Class Advanced Packaging Foundry.
• Leading DMO to deliver new technologies, implement new business models, and support manufacturable & cost competitive foundry and systems.
• Active collaboration with technology development organizations to start-up and ramp new technologies to high volume and develop game-changing methodologies to enable significant operational improvements
• All operational aspects of DMO which operates advanced and high-volume facilities globally:
o Safety: DMO has a complex manufacturing environment with safety as the top priority
o People: Global org health, engagement, and development across multiple locations
o Quality: Delivering products that meet/exceed quality commitments to customers
o Cost: Manage a large operational budget with a goal to achieve world-class costs. Responsible for driving to and exceeding Product Margin goals.
o Output: Deliver consistent output on technologies and new product introductions to meet/exceed customer demand.
This role requires experiences in:
• Leading a global semiconductor manufacturing network and third-party suppliers, including experience in fab process, supply chain and materials management, and quality assurance
• Operational Excellence to identify and manage opportunities to improve safety, costs, output, quality/yields and other KPIs as well as expanding and optimizing the manufacturing network.
• Technical leadership in semiconductor manufacturing processes; breadth of experience across wafer fab and back-end processes (assembly and test), and tooling.
• Developing future innovation and/or emerging capabilities
• Collaborating, influencing and working across a highly matrixed organization with process development, supply chain, product/business and other engineering teams on joint roadmap development and other co-dependencies.
• Recognizing material, process-oriented and/or delivery issues which have a substantive impact on profitability.
• Articulating the implications of issues in financial terms and impact on P&L.
• Building relationships with key ecosystem partners and leveraging internal and external relationships- and working with Technology Development/R&D and Engineering, Finance, IT, HR and partner-suppliers to drive innovation and operational efficiency, as well as working with and understanding the operations of suppliers and construction.
Key leadership capabilities include:
• Leading large diverse global organizations
• Strong manufacturing and operational experience and leadership
• Strong execution and results focus
• Superior networking and influencing skills and the ability to build followership
• A combination of business acumen, organizational savvy, and technical expertise
• Ability to work cross-organizationally through matrix reporting structures to accomplish strategic objectives as well as organizational development goals
• Excellent business judgment & acumen, strategic vision, and negotiation skills
• Solid financial analysis skills, including creating and understanding different industry and Intel business unit models to optimize financial results for Intel
• Semiconductor foundry experience preferred
Qualifications:
Minimum Qualifications
- Bachelor's degree in engineering, science, or a related field. MSc or PhD is considered a plus
- 15 years of direct semiconductor factory experience with a strong technical background
- 10 years of management experience in semiconductor fab, advanced packaging, or assembly test
- Experience managing managers, 2nd level managers and senior technical contributors
- Strong working knowledge of device physics, process technology and assembly-test
- Detailed understanding of model-based problem solving as well as Fab process control systems and methodologies
- Experience leading large fab operations including engineering and manufacturing factory functions
- Experience managing external manufacturing partnerships and suppliers.
Preferred Qualifications
- Experience working for a world-class semiconductor foundry
- Advanced packaging experience
- Technology development experience
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
US, Arizona, Phoenix, US, New Mexico, Albuquerque
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
