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Salary THE ROLE:
As a Senior Mechanical EngineerInterconnect Specialist in the Data Center and GPU Accelerated Processing (DCGAP) Thermal Mechanical Engineering department, you will be responsible for the mechanical design, technology development, and production support specifically around cables, connectors and related interconnect technology for the AMD Data Center GPU products in this expanding and strategic market for AMD.
THE PERSON:
The Senior Mechanical EngineerInterconnect Specialist in the Thermal Mechanical Engineering team will have excellent communication skills, planning skills, technical expertise, and critical problem-solving skills. They will be well versed in server and rack as well as data center infrastructure and comfortable in a fast paced, multi-tasking environment. The ideal candidate would have extensive experience in datacom connectors and cables design, metals, plastics, molding, stamping, plating, automation and machine tools maintenance.
KEY RESPONSIBILITIES:
This position requires a leadership mindset, and involves development strategy for business growth, product innovation, and manufacturing reliable product at low cost with good margin. The candidate will be coordinating with component suppliers, product architects, system & SI engineers, ME, EE, GOE, DFx, SQE and procurement personnel to ensure all cables and connections meet the requirements for our system designs.
PREFERRED EXPERIENCE:
- Worked with CPU sockets (AMD and Intel), DDRx memory sockets, CXP, QSFP+, QSFP28, 56Gbs+ high speed connectors, GenZ, SAS/PCIE HDD/SSD, SD card, fine pitch and power connectors & cables, switches) in datacenter servers, and storage applications.
- Designed electrical contacts/terminals (geometry) with good mechanical wipe and minimum electrical stub to meet both mechanical (have reliable contact at worst condition) and electrical (minimum contact resistance) requirements in high-speed applications (PCIe Gen5 and above).
- Implemented new interconnect technologies (direct wire attach) by coordinating with component suppliers, product architects, system & SI engineers, ME, EE, GOE, DFx, SQE and procurement personnel.
- Designed differentiated interconnect solutions in server/storage products for high-speed data transfer (PCIe-Gen5+) applications with the objective of high reliability and low cost to byte ratio.
- Involved in the hardware architecture of racks, towers, blades and converged infra-structure server and storage productdesigns especially planar, mid-plane, EDSFF backplane, I/O module, PDB, PREC, DC-SCM, Boss, control panel and riser cards.
- Partnership with ODMsduring concept design phase and enabled them to use proper components qual process to ensure reliable and robust interconnect systems.
- Have experience in using QA tools like QFD, Engineering and manufacturing feasibility reviews, FEA, DFMEA, PFMEA, GD&T, tolerance stack up study (RSS) and rapid prototyping during product development to prove out product design before kick-off the production tools for manufacturing.
ACADEMIC CREDENTIALS:
BS in Mechanical Engineering required, Masters preferred.
LOCATION:
Austin, TX
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AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
