Address
Form of work
SalaryNVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world.
NVIDIA is hiring a Senior Failure Analysis Engineer. In this role, you'll play a key part of our Supplier Quality Failure Analysis team, aiming to take FA capabilities to new heights. The role strives to conduct comprehensive physical failure analyses, from defect localization to uncovering the root cause responsible for customer return units, yield losses and reliability failures. This is an onsite position based in Santa Clara, California.
What you'll be doing:
- Performing electrical analysis and fault localization to assist Supplier FA teams in evaluations or experiments for physical root cause analysis, design optimization and process improvement for new product yield and reliability
- Conducting non-destructive imaging such as 3D Xray, Ultrasound, EOTPR, Thermal imaging to identify physical defects on die, board and system level and aid physical target preparation
- Using Physical Sample preparation such as mechanical cross-sectioning, parallel de-layering, chemical and plasma etch de-processing of IC devices at die, package, component, and board levels
- Summarize the Failure Analysis findings in a comprehensive report and discuss it with internal and external customers and suppliers
- Develop Failure Analysis improvement strategies that help increasing the overall product quality
What we need to see:
- Possess an in-depth understanding of semiconductor IC, IC package and board fabrication/assembly processes
- Proficiency in IC Package device fault isolation and sample preparations for various failure analysis tasks, including defect localization and physical root cause analysis
- Hands-on experience in non-destructive testing, physical sample preparation, Optical & Electron microscopy
- Proficient in mechanical cross sectioning, Focused Ion Beam system and laser based package preparation
- Familiarity with 2D/3D X-Ray, Ultrasound, Curve-tracing, Thermal/Photo Emission Microscopy, CAD layout, and respective analysis methods
- Strong written and verbal communication skills
- 8+ years of industrial experience in IC failure analysis
- B.S. degree in Science or Engineering or equivalent experience
With highly competitive salaries and a comprehensive benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We have some of the most brilliant and talented people in the world working for us. Are you creative and autonomous, with a genuine passion for technology? We want to hear from you.
The base salary range is 136,000 USD - 218,500 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. You will also be eligible for equity and
benefits
. NVIDIA accepts applications on an ongoing basis.
