Process Engineer

Process Engineer Responsibilities:

• Focus on design and execution of integration engineering with emphasis on panel/wafer lamination, adaptive laser direct imaging, and projection/contact photolithography, component thinning/planarization, wet/dry etch, and metal deposition.
• Innovate packaging solutions for high-density heterogeneous and flexible/stretchable integration of electronic components and devices.
• Design and oversee internal, external, and hybrid manufacturing workflows
• Contribute to new technologies and new methods innovation to close critical gaps
• Design experiments for development, evaluation, and yield enhancement of processes, devices, and prototypes
• Partner and collaborate with researchers, hardware engineers, device and systems integration teams, and external partners
• Execute fabrication workflows, identify in-line fabrication issues, propose solutions/workarounds, and drive process improvement

Minimum Qualifications

• M.S. or equivalent degree in the field of Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Material Science, or related field.
• Experience with advanced packaging, flexible printed circuit (FPC), printed circuit board assembly (PCBA), 2.5D/3D integration and/or related technologies, preferably in consumer, wearable, or ruggedized electronic
• Experience with handling and integration of thinned components, surface mount technologies (SMT), and back end of line (BEOL) technologies including: thinning, dicing, soldering, eutectic bonding, metal finishing/electrochemical deposition, through silicon via (TSV), flip-chip, wire/die bonding, ball/stud bumping, thermocompression bonding, copper pillar bonding, hybrid bonding, underfill, over molding and/or other encapsulation methods
• Demonstrated successful outcomes in innovating and maturing hardware research, instrumentation and characterization methods, electrical layout, mechanical design, and data analysis or related areas.
• Experience in the development and use of high performance electronic materials

Desired Qualifications

• PhD or more degree in the field of Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Material Science, or a related field
• Experience in the domain of advanced packaging including FPC, MCM, SiP, 2.5D/3D integration or Flexible Hybrid Electronics (FHE), or similar technologies
• Working experience with reliability testing and failure analysis tools including die/ball shear/wire pull testing, X-ray, C-SAM, thermal cycling, and other environmental testing
• 2+ years of experience with wearable technologies and technical soft goods
• Practical experience in hermetic/MEMS packaging processes, thermal management/materials, and injection/transfer molding
• Experience with leveraging Finite Element Analysis (FEA) modeling and simulation to drive design acceleration and prevent product failures
• Experience in System-in-Package (SiP) and/or Multi-Chip Module (MCM) design, manufacturing, and validation
• Experience with signal integrity and power integrity simulation (e.g. HFSS) and validation (high-speed eval)

Job Type: Full-time

Pay: $85,000.00 - $149,000.00 per year

Benefits:

• Dental insurance
• Employee assistance program
• Health insurance
• Paid time off
• Professional development assistance
• Relocation assistance

Experience level:

• 4 years

Schedule:

• 8 hour shift

Work setting:

• In-person

Education:

• Master's (Required)

Experience:

• 2.5D/3D integration and/or related technologies: 4 years (Required)
• handling and integration of thinned components: 4 years (Required)
• development and use of high performance electronic materials: 4 years (Required)
• surface mount technologies: 4 years (Required)
• thinning, dicing, soldering, eutectic bonding: 4 years (Required)
• flip-chip, wire/die bonding, ball/stud bumping: 4 years (Required)
• advanced packaging, flexible printed circuit (FPC),: 4 years (Required)

Ability to Commute:

• Redmond, WA 98052 (Required)

Ability to Relocate:

• Redmond, WA 98052: Relocate before starting work (Required)

Work Location: In person