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Form of workJob Description
Acara Solutions and our client in South, Everett, WA have a DIRECT hire position available for a
Mechanical Engineer with a Micro-Electronics Packaging background
The salary range tops out at around $141K.
This position requires experience in sensor and micro-electronics packaging.
This is an R&D team position where the engineer will work on increasing sensor performance and adding measured parameters for harsh environment aerospace & defense applications.
The Mechanical Engineer will add expertise to address technical challenges for cost effective packaging of an expanded sensing product portfolio, including Proximity Sensors, Silicon-on-Sapphire Pressure Sensors, Multi-Parameter Sensors, and Wireless Sensing.
Technical challenges where expertise/experience is highly desired:
- Sensing element mounting (chip on board, die attach/underfill, wire bonding, pad metallization, mechanical isolation)
- Micro-electromechanical systems (MEMS) design for harsh environments
- Sensor and sensing element calibration/characterization
The Senior Mechanical Engineer is a top contributor who needs little to no supervision and uses originality, ingenuity and experience to perform engineering duties in researching, planning, designing, and developing products for use in the Aerospace or Electronics marketplace. The Senior Mechanical Engineer works within a collaborative Integrated Product Team (IPT) environment while responsible for multiple independent tasks.
· Deliver integrated sensor mechanical designs, from initial concept to production
o Analyze design requirements and objectives, define optimum design criteria and approach, design component or system elements
o Direct development testing on new or modified designs
· Mentor and lead other engineers in the area of expertise
· Plan, estimate, prioritize, and manage work activities to support meeting project schedules and budgets. Utilize experience and judgment to plan and accomplish goals.
· Generate and review product development documentation, including proposals, technical reports, procedures, correspondence, etc. necessary to satisfy customer and program requirements.
· Self-directed and motivated while working and communicating effectively within a team environment that consists of several engineering, operations, quality, and business disciplines.
· Generate models and conduct analyses in compliance with customer requirements and appropriate regulatory agencies.
· Perform design experiments and evaluate test results to validate analysis.
Required Skills / Qualifications:
- Bachelor's degree in Mechanical Engineering, Physics or related engineering discipline (a plus to have MSME or PhD)
- Min 5 years of experience in sensor and micro-electronics packaging
- This experience should include knowledge of mechanics of materials, materials science, shock, vibration, heat transfer, and dimensional tolerance analysis
- Min 3 years of 3D CAD experience such as Autodesk Inventor
- Min 1 year of numerical analysis software such as Matlab
This is an ITAR facility, U.S. Persons Required
Preferred:
Aerospace, medical device or other highly regulated industry experience
Aleron companies (Acara Solutions, Aleron Shared Resources, Broadleaf Results, Lume Strategies, TalentRise, Viaduct, and Aleron's strategic partner, SDI) are Equal Employment Opportunity and Affirmative Action Employers. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender identity, sexual orientation, national origin, genetic information, sex, age, disability, veteran status, or any other legally protected basis. The Aleron companies welcome and encourage applications from diverse candidates, including people with disabilities. Accommodations are available upon request for applicants taking part in all aspects of the selection process.
Applicants for this position must be legally authorized to work in the United States. This position does not meet the employment requirements for individuals with F-1 OPT STEM work authorization status.
