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Form of workJob Details:
Job Description:
Intel's Technology Development Component Research (TD CR) delivers innovative semiconductor and packaging technologies research and development. The group focuses on unique, enabling capabilities across all aspects of Intel's semiconductor processing and packaging roadmap.
Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials, and integration schemes across a wide variety of novel applications.
The Components Research (CR) team is looking for a passionate candidate to join us as a Circuit Design intern and work on the exploration of a novel memory technology. Final scoping of project will be determined based on intern experience and business needs.
The ideal candidate should exhibit the following behavioral traits:
Length of internship: Minimum of 3 months for summer 2024 with the possibility to extend it as per business needs.
Qualifications:
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum qualifications:
Preferred qualifications:,
Job Type:
Student / Intern
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Job Description:
Intel's Technology Development Component Research (TD CR) delivers innovative semiconductor and packaging technologies research and development. The group focuses on unique, enabling capabilities across all aspects of Intel's semiconductor processing and packaging roadmap.
Components Research engineers are responsible for leading programs to design, fabricate and analyze novel devices/interconnects/patterning, materials, and integration schemes across a wide variety of novel applications.
The Components Research (CR) team is looking for a passionate candidate to join us as a Circuit Design intern and work on the exploration of a novel memory technology. Final scoping of project will be determined based on intern experience and business needs.
The ideal candidate should exhibit the following behavioral traits:
- Highly motivated individual willing to work under pressure and deliver high quality results on time
- Problem-solving and analytical skills
- Effective prioritization and time management skills
- Stakeholder management, strong collaboration, tolerance for ambiguity, and critical thinking
- Excellent teamwork ethics
- Willing to work in an agile work environment with a fast-paced task flow
- Good interpersonal skills
Length of internship: Minimum of 3 months for summer 2024 with the possibility to extend it as per business needs.
Qualifications:
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum qualifications:
- You must be pursuing a PhD degree in a discipline such as Electrical Engineering or Physics,
- Must have the required degree or expect the required degree by September 2025.
- Experience with SRAM design and advanced VLSI systems
- Experience with novel memory design
- Strong understanding of semiconductor physics
- Deep understanding of FinFET/gate all around technology
- Experience with analog/mixed-signal Circuit Design and tools like Cadence Virtuoso for schematic entry/layout and HSPICE/Spectre for simulations.
Preferred qualifications:,
- Knowledge of leading nonvolatile memory technologies
- Experience with Static Timing Analysis, timing convergence
- Experience with tape-out of high performance ICs.
- Experience with DTCO (Design Technology Co-optimization) and PPA (Power Performance Area) analysis
- Experience with logic synthesis, place, and route tools
- Experience with compact modeling for novel devices using Verilog-A
- Experience with scripting languages like python
Job Type:
Student / Intern
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
