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Form of workJob Details:
Job Description:
We are looking for an SoC Design Engineer to work on Test Chip Lead Vehicles, which are primarily used by our Design Enablement (DE) and Logic Technology Development (LTD) team for Intel's next generation technology development and high-volume certifications.
This role primarily focuses on the Physical Design domain and includes engagement with manufacturing partners on cutting-edge process nodes. This role includes, but is not limited to, the following responsibilities:
-Developing layout design methodology and productivity automation for cutting edge process nodes.
- Building and executing tactical plans to converge hierarchical SoC layout designs against aggressive schedule requirements.
- Qualification of the full chip design to meet tape-out requirements.
- Working with tool/flow owners and vendors for ongoing tool/methodology improvement.
- Motivation to continuously learn and drive to push improved layout productivity and efficiency
This is an entry level position and compensation will be given accordingly.
#DesignEnablement
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences .
Minimum Qualifications:
Candidate must possess a MS degree with 6+ months of experience in Electrical Engineering or Computer Engineering or related fields.
Must have the required degree by start date.
6+ months experience in the following:
- Layout out tools.
- Design rule checking (DRC) and Layout vs Schematic (LVS).
Preferred Qualifications:
6+ months of experience in the following:
- Cadence Virtuoso, Synopsys ICC2, ICC2-DP, Synopsys ICV or Calibre rule decks.
- Scripting or programming languages, such Perl, Python, TCL etc.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
Job Description:
We are looking for an SoC Design Engineer to work on Test Chip Lead Vehicles, which are primarily used by our Design Enablement (DE) and Logic Technology Development (LTD) team for Intel's next generation technology development and high-volume certifications.
This role primarily focuses on the Physical Design domain and includes engagement with manufacturing partners on cutting-edge process nodes. This role includes, but is not limited to, the following responsibilities:
-Developing layout design methodology and productivity automation for cutting edge process nodes.
- Building and executing tactical plans to converge hierarchical SoC layout designs against aggressive schedule requirements.
- Qualification of the full chip design to meet tape-out requirements.
- Working with tool/flow owners and vendors for ongoing tool/methodology improvement.
- Motivation to continuously learn and drive to push improved layout productivity and efficiency
This is an entry level position and compensation will be given accordingly.
#DesignEnablement
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences .
Minimum Qualifications:
Candidate must possess a MS degree with 6+ months of experience in Electrical Engineering or Computer Engineering or related fields.
Must have the required degree by start date.
6+ months experience in the following:
- Layout out tools.
- Design rule checking (DRC) and Layout vs Schematic (LVS).
Preferred Qualifications:
6+ months of experience in the following:
- Cadence Virtuoso, Synopsys ICC2, ICC2-DP, Synopsys ICV or Calibre rule decks.
- Scripting or programming languages, such Perl, Python, TCL etc.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
