Microelectronics Advanced Packaging Subject Matter Expert

Microelectronics Advanced Packaging Subject Matter Expert

Key Role:

Leverage technical leadership and Subject Matter Expertise to defense clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, ball grid array, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and technology assessment methods to enable shared understanding of defense packaging objectives, testing and evaluation of those technologies, and development of roadmaps, business models, and technology models for improved access and collaboration in the future.

Basic Qualifications:

10+ years of experience with hands-on engineering, including microelectronics packaging technologies
5+ years of experience with the design and analyses of electronic packaging failure modes in temperature cycling, shock, and vibration test conditions
Knowledge of new packaging architectures, including multi-chip, chip on-chip, and chip on the wafer, and package architecture assembly and reliability challenges
Knowledge of the types of packaging used today and the gaps in today’s technologies and approaches, ongoing research in Advanced Packaging, what efforts are underway, and their respective goals and timelines
Experience packaging structural, thermal, materials, or modeling toolkits, including ABAQUS, COMSOL, or SOLIDWORKS, and material testing for mechanical characterization, reliability testing methods, or data analyses
Knowledge of microelectronics packaging performance parameters
Ability to perform analytical calculations of packaging performance, provide accurate technical assessments of various approaches, and incorporate these into technology roadmaps to guide industry activities
Ability to interpret defense needs for advanced microelectronics packaging, evaluate the performance of various technologies and vendors, and define a technology and business roadmap that defines the path forward to senior stakeholders
Ability to obtain a security clearance
Bachelor's degree in Engineering or Science

Clearance:

Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information.

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Compensation

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Salary at Booz Allen is determined by various factors, including but not limited to location, the individual’s particular combination of education, knowledge, skills, competencies, and experience, as well as contract-specific affordability and organizational requirements. The projected compensation range for this position is $96,600.00 to $220,000.00 (annualized USD). The estimate displayed represents the typical salary range for this position and is just one component of Booz Allen’s total compensation package for employees. This posting will close within 90 days from the Posting Date.

Work Model
Our people-first culture prioritizes the benefits of flexibility and collaboration, whether that happens in person or remotely.

If this position is listed as remote or hybrid, you’ll periodically work from a Booz Allen or client site facility.
If this position is listed as onsite, you’ll work with colleagues and clients in person, as needed for the specific role.

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