Job Description
Create and analyze design concepts using FEA & thermal analysis software.
Organization of thermal design and analysis as an IPT lead; frequently interfacing directly with customer technical leads and management.
Documenting and presenting design & analysis results to customers at formal gate and design reviews.
Development of thermal test plans to manufacture and test payload sensor systems.
Support new business opportunities and mentor junior level staff.
Perform thermal design and analysis tasks on complex mechanical hardware including precision mechanisms, electro-mechanical devices, aerospace mechanism design, complex electronics packaging, supporting space-based deployable mechanisms, avionics, innovative thermal and ground based systems.
Program support also includes requirements derivation and verification, system architecture development, loads derivation, trade studies, design sensitivity/optimization studies, preliminary and final design analysis, generation of analysis documentation (including presentation materials, and deliverable data packages), and leading system test activities.
Work multiple tasks in a fast-paced environment and adapt quickly to changing situations.
Qualifications:
Proficiency in thermal analysis tools such as Thermal Desktop (preferred), Sinda, Thermal Fluent, Icepak, etc.
Experience with thermal vacuum testing.
Preferred Additional Skills:
Strong analytical skills with emphasis on using and/or directing finite element analysis (FEA).
Experience with finite element analysis software.
Able to support design decisions with well documented engineering analyses and calculations.
Able to analyze problems and to focus and drive down to the root cause of problems quickly.
Experience as a lead engineer, project engineer, or IPT lead is a plus.
Experience with Microsoft office tools, Word, Excel, PowerPoint.
Active Secret Clearance.
SKILLS AND CERTIFICATIONS
Thermal desktop software experience required
Experience with thermal vacuum testing