Dynetics, a wholly owned subsidiary of Leidos, is seeking a talented Entry-Level Embedded Design Engineerto join a diverse team to create unique solutions for complex problems. With offices across the United States engaging in the defense, space, cyber and commercial fields, Dynetics provides responsive, cost-effective engineering, scientific and IT solutions.
The Product Engineering Department is a design-focused group of engineers specializing in advanced hardware-based solutions. The individual selected for this position will be a Design Engineer with varied technical interests and demonstrated engineering skills. The individual must be a self-starter with experience working with inter-disciplinary teams to solve challenging technical problems focused around embedded systems. The engineer will work closely with embedded systems integrated into a diverse range of aerospace and military systems including manned/unmanned ground/air vehicles, missiles, defensive radars, and space systems.
The selected candidate will be expected to execute in a fast-paced, small team environment through all phases of the product life cycle from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. The engineer will be responsible for implementing, and testing embedded hardware and firmware on a variety of platforms including FPGAs, microcontrollers, microprocessors, and mixed signal designs. Additional skills such as digital-signal processing (DSP) design, printed circuit board (PCB) design, experience with technical trade studies, and evaluation of technology improvements are a plus.
With a product focus, the individual is also expected to actively partner with other engineers, project managers, technicians, and the customer to develop solutions that adhere to a diverse set of requirements. Additionally, the engineer will support resolution of technical issues that are discovered during the manufacture and test of deliverable products. This will include troubleshooting board-level issues, assessing failures for root cause, and identifying corrective actions.
The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.
Basic Qualifications:
- Bachelors degree in Electrical Engineering, Computer Engineering, or equivalent degree from an ABET-accredited institution with a 3.0 or higher GPA
- Demonstrated familiarity with programming and/or hardware description languages such as: C, C++, VHDL, Verilog, assembly
- Knowledge with communication protocols such as: UART, Ethernet, SPI, I2C, CAN bus, etc.
- Hands-on laboratory experience with instrumentation, test equipment, and debug/test methods
- Capable of performing in a collaborative engineering environment working closely with multi-disciplinary teams
- Experience effectively communicating within a team environment
- Candidates must be a resident of the North Alabama area or willing to relocate to the Huntsville - North Alabama, AL area
Other Qualifications:
Preference shown to candidates who have experience and/or working knowledge of:
- Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
- RISC microprocessors architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
- Memory architectures, types, and caching
- GNU/Linux and developing kernel drivers
- Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, uC/OS-II)
- Electronics and PCBA design
- Leading design teams including technical leadership, budgeting, and scheduling
Security Requirements:
Candidate must be a US Citizen and possess (and be able to maintain) a Final Secret Clearance or meet the eligibility to obtain (and maintain) a Secret Clearance.
Pay Range:
Pay Range $53,950.00 - $97,525.00
The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.