3D Polymers Agent Integration Test Engineer

3D Polymers Agent Integration Test Engineer
Description -
Job Description:
We are seeking a highly motivated and experienced Test Engineer to join our additive manufacturing lab in Corvallis, Oregon. The successful candidate will be responsible for designing and implementing test procedures, analyzing test results, and identifying areas of improvement. The Test Engineer will also be responsible for maintaining and calibrating equipment and ensuring that it is in good working condition.
The ideal candidate should have experience with HP Multi Jet Fusion (MJF) technology, a powerful industrial 3D printing technology from HP to enable direct digital manufacturing. The Test Engineer will be responsible for designing and implementing test procedures for additive manufacturing products using MJF technology. They will also be responsible for experimental design and setup, analyzing test results and identifying areas of improvement.
Responsibilities:

• Perform any necessary equipment modifications to enable R&D activities (especially modifications to hardware, print modes and firmware on non-commercial R&D printer units: Dalmata, Corellia, Jaku with UV Lamps)
• Design and implement test procedures for additive manufacturing products using MJF technology
• Analyze test results (including printer telemetry) and identify areas of improvement
• Maintain and calibrate testing equipment
• Ensure that testing equipment is in good working condition
• Establish workflows to support non-standard R&D printing experiments and data informatics
• Work with cross-functional teams to ensure that products meet the required quality standards
• Develop and maintain test documentation
• Provide technical support to other teams as-needed

Qualifications:

• Bachelor's degree in Electrical Engineering or a related field
• 3+ years of experience in a Test Engineering role
• Experience with additive manufacturing processes and equipment
• Experience with HP Multi Jet Fusion (MJF) technology
• Strong analytical and problem-solving skills
• Excellent communication and interpersonal skills
• Ability to work independently and as part of a team

Skills:

• Writing, reviewing, and/or modifying code and scripts
• Deploying a variety of software tools, including internally developed R&D tools, in combination to deliver comprehensive data sets
• Maintaining and updating firmware
• Hardware, Electrical and Firmware troubleshooting
• Ability to design and fabricate custom tooling (HW, EE and SW) solutions as required for non-standard R&D efforts

Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. The typical base pay range for this role across the U.S. is $79,150 - $121,900annually with additional opportunities for pay in the form of bonus and/or equity. Pay within this range varies by work location and may also depend on job-related knowledge, skills, and experience. Your recruiter can share more about the specific salary range for the job location during the hiring process.
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Not Specified
Relocation -
Yes
EEO Tagline -
HP Inc. is EEO F/M/Protected Veteran/ Individual with Disabilities.