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Form of workApplied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale helps our customers - who make smartphones, supercomputers, virtual reality headsets, autonomous vehicles and more - transform their ideas into reality. Our innovations Make Possible® a Better Future.
Inside our company, we apply the idea of make possible as we work together. We value our people and teams who turn possibilities into reality by advancing our strategy, accomplishing great things and empowering others. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.
If you're looking for a great place to grow your career, consider Applied Materials. With the data explosion and new investment in semiconductors, it's an exciting place to be.
Applied Materials' Advanced Packaging Department is searching for an intern to join our team in Summer/Fall 2024! Advanced packaging technology is critical to continue enabling Moore's law through heterogenous integration of chiplets. Chiplets are integrated on the package thanks to novel wafer level processes such as hybrid bonding. New materials selection and integration within the hybrid bonding process flow are key to scale the next generation of interconnects. This internship will be focusing on advanced Packaging process integration for interconnect scaling . The position will entail the following:
Requirements
Compensation
$36 - $46 per hour
The salary offered to a selected candidate will be based on a number of factors including location and education level and will vary depending on confirmed job-related knowledge, skills, and experience
Qualifications
Education:
Doctorate Degree, Master's Degree
Skills:
Certifications:
Languages:
Years of Experience:
Work Experience:
Additional Information
Time Type:
Full time
Employee Type:
Intern / Student
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
Inside our company, we apply the idea of make possible as we work together. We value our people and teams who turn possibilities into reality by advancing our strategy, accomplishing great things and empowering others. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong, feels empowered to bring their whole self to work, and is inspired to grow.
If you're looking for a great place to grow your career, consider Applied Materials. With the data explosion and new investment in semiconductors, it's an exciting place to be.
Applied Materials' Advanced Packaging Department is searching for an intern to join our team in Summer/Fall 2024! Advanced packaging technology is critical to continue enabling Moore's law through heterogenous integration of chiplets. Chiplets are integrated on the package thanks to novel wafer level processes such as hybrid bonding. New materials selection and integration within the hybrid bonding process flow are key to scale the next generation of interconnects. This internship will be focusing on advanced Packaging process integration for interconnect scaling . The position will entail the following:
- Literature review focused on substrate, 2.5D and 3D architectures
- Present key finding and data summary in weekly meeting in front of engineering team
- Set-up DOE and track outcome
- Model based problem solving regarding new materials introduction and qualification.
- Define integrated flows to enable target outcome
- Lab validation of advanced result (inspection, metrology)
- Up to 10% of domestic travel
Requirements
- Student must be pursuing a Master's or Doctorate degree program in Chemical Engineering or a related field.
- Student must be in good academic standing at their university, with a preferred GPA of 3.0 or above on a 4.0 scale
- Strong understanding of chemistry of materials behavior and electro-chemical reactions
- Operate in high pace environment with autonomy.
- Model-based problem-solving attitude with high tolerance for ambiguity is a plus for successful candidates.
- Project Management skills
- Knowledge of advanced packaging architecture is preferred.
- Electrical or Computer Engineering or related field with package design and Signal/Power Integrity analysis knowledge is a plus
Compensation
$36 - $46 per hour
The salary offered to a selected candidate will be based on a number of factors including location and education level and will vary depending on confirmed job-related knowledge, skills, and experience
Qualifications
Education:
Doctorate Degree, Master's Degree
Skills:
Certifications:
Languages:
Years of Experience:
Work Experience:
Additional Information
Time Type:
Full time
Employee Type:
Intern / Student
Travel:
Yes, 10% of the Time
Relocation Eligible:
Yes
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
