Address
Form of work
SalaryJob Description
Expanding Global Semiconductor Manufacturing Company. Semiconductor/IC Chip Industry.
This Jobot Job is hosted by: Jourdan Castro
Are you a fit? Easy Apply now by clicking the "Apply Now" button and sending us your resume.
Salary: $150,000 - $200,000 per year
With offices in Irvine, CA and Sunnyvale, CA, and HQ in China, we are a leading semiconductor manufacturer that specializes in the large-scale production of high-quality, compound semiconductor chips and devices. We believe that semiconductors are the cornerstone of the modern industry and are committed to being a world-class manufacturing and service platform of compound semiconductors. We continue to grow and expand, and are looking for Wafer Process Engineers to join our team at our Irvine location.
Are you an experienced Process Engineer in the semiconductor industry? Please keep reading...
What we offer:
Is your background a fit? Please apply if you meet the following criteria:
Qualifications:
Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.
This Jobot Job is hosted by: Jourdan Castro
Are you a fit? Easy Apply now by clicking the "Apply Now" button and sending us your resume.
Salary: $150,000 - $200,000 per year
A bit about us:
With offices in Irvine, CA and Sunnyvale, CA, and HQ in China, we are a leading semiconductor manufacturer that specializes in the large-scale production of high-quality, compound semiconductor chips and devices. We believe that semiconductors are the cornerstone of the modern industry and are committed to being a world-class manufacturing and service platform of compound semiconductors. We continue to grow and expand, and are looking for Wafer Process Engineers to join our team at our Irvine location.
Are you an experienced Process Engineer in the semiconductor industry? Please keep reading...
Why join us?
What we offer:
- Competitive salary
- Comprehensive benefits package
- PTO, sick time, vacation
- 401k
- Opportunity to build operations from "ground-up"
Job Details
Is your background a fit? Please apply if you meet the following criteria:
Qualifications:
- Experience and skills in backside processing of semiconductor devices and circuits.
- Experience should include processing expertise with wafer mounting, wafer thinning (lapping, polishing, grinding, CMP, etc.), wafer dicing (laser scribing, dicing, scribe and break, etc.), die separation, picking and inspection.
- Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.
- Knowledge of semiconductor processing with a focus in backside wafer processing and die separation.
- Strong observation and oral documentation skills
- Ability to develop and maintain statistical process control (SPC) charts; knowledge in data plotting using Excel, JMP or similar tools
- Strong general skills with office productivity software such as MS Excel, PowerPoint and MS word. Knowledge of AutoCAD is a definite plus.
Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.
