Address
Form of work
SalaryJob Description
- Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages
- Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
- Develop new assembly technologies, run process DOE’s, to define process windows for new package development
- Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
- Work closely with offshore assembly and substrate partners to develop new processes
- Work closely with IC design teams to define package design rules and define packages to meet their requirements
- Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products
Job Requirements
- BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
- Minimum experience 12 years in semiconductor packaging technology.
- Experience leaded multi-die packages.
- Understanding of organic laminate technologies manufacturing and supplier capabilities.
- Experience in SMT or passive integrated package assembly is a plus.
- Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
- Experience with package substrate design rules, tools (including AutoCAD).
- Knowledge of AEQ Automotive reliability requirements.
- Knowledge of APQP automotive development process
- Knowledge of JEDEC/IPC design standards.
- Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
- Travel to Asia to attend technology reviews and resolve subcon/supplier issues
Pay: Up to $220K, commensurate with experience.
