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Form of work
Salary```Job Summary:```
Job Description
- Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages
- Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
- Develop new assembly technologies, run process DOE’s, to define process windows for new package development
- Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
- Work closely with offshore assembly and substrate partners to develop new processes
- Work closely with IC design teams to define package design rules and define packages to meet their requirements
- Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products
Job Requirements
- BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
- Minimum experience 12 years in semiconductor packaging technology.
- Experience leaded multi-die packages.
- Understanding of organic laminate technologies manufacturing and supplier capabilities.
- Experience in SMT or passive integrated package assembly is a plus.
- Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
- Experience with package substrate design rules, tools (including AutoCAD).
- Knowledge of AEQ Automotive reliability requirements.
- Knowledge of APQP automotive development process
- Knowledge of JEDEC/IPC design standards.
- Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
- Travel to Asia to attend technology reviews and resolve subcon/supplier issues
```Duties:```
- Design and develop innovative packaging solutions for our products
- Collaborate with cross-functional teams to understand product requirements and develop packaging specifications
- Utilize SolidWorks and Creo software to create 3D models and drawings of packaging designs
- Conduct feasibility studies and cost analyses for different packaging options
- Perform root cause analysis on packaging failures and implement corrective actions
- Optimize packaging designs for efficient assembly, transportation, and storage
- Collaborate with suppliers to source materials and components for packaging systems
- Conduct testing and validation of packaging designs to ensure compliance with industry standards and regulations
- Provide technical support to manufacturing teams during production ramp-up
```Experience:```
- Bachelor's degree in Mechanical Engineering or related field
- Minimum of 5 years of experience in packaging engineering or related role
- Proficiency in SolidWorks, Creo, and other CAD software
- Strong knowledge of lean manufacturing principles
- Experience with robot programming for automated packaging systems is a plus
- Familiarity with quantum engineering concepts is a plus
- Excellent problem-solving skills with the ability to perform root cause analysis
- Strong communication skills and ability to collaborate effectively with cross-functional teams
If you are a highly motivated individual with a passion for innovation and a strong background in packaging engineering, we would love to hear from you. Apply today to join our dynamic team!
Job Type: Full-time
Salary: $190,000.00 - $195,000.00 per year
Benefits:
- 401(k)
- Dental insurance
- Health insurance
- Life insurance
- Paid time off
- Vision insurance
Experience level:
- 11+ years
Schedule:
- 8 hour shift
- Monday to Friday
Work setting:
- In-person
- Manufacturing facility
Ability to Relocate:
- San Jose, CA 95123: Relocate before starting work (Required)
Work Location: In person
