Micro-Electronic Assembler (North Amityville, Ny)

Description:

Job Title: Micro-Electronic Assembler B (North Amityville, NY)

Job Code: SAS20233003-99098

Job Location:North Amityville NY

Job Description:

L3Harris is seeking a Micro-Electronic Assembler to join our clean room assembly team. We’re looking for dedicated individuals who always show up for work on time and who thrive in a team-oriented environment. Successful candidates will have some prior experience in micro-electronic assembly and be capable of reading blueprints.

Essential Functions:

• Perform complex wiring and assembly operations to production standards.
• Skilled in the area of substrate/component attach, ball bonding, wedge bonding and parallel gap welding.
• Work with and assist technical personnel such as Methods Analysts, Engineering, etc. in working out practical problems in relation to their work assignments.
• Set-up and operate all applicable equipment.
• Record and maintain data as required.
• Ability to work from drawings, operation sheets and verbal instruction.
• Must possess the knowledge and capability of applying those techniques necessary to perform the applicable micro-electronic assembly operations.
• Ability to work with extremely small devices under a microscope.
• Ability to work from drawings, operation sheets, assembly procedures, material specifications and processes, and verbal instructions.
• Apply the knowledge and techniques necessary to the manufacture of micro-electronic assemblies.

Qualifications:

• Requires developing job knowledge/skills. Requires a High School Diploma or equivalent and a minimum of 4 years of prior relevant experience or 2 years post-Secondary/Associates Degree with 0 to 2 years of prior related experience.

Preferred Additional Skills:

• Experience with automatic microelectronic assembly equipment, epoxy dispenser, pick and place and automatic ball bonder
• Knowledge of MIL-STD 883 as related to wire bonding and component attach
• Must have extensive knowledge of all assembly skills from ball bonding, wedge bonding, parallel gap welding substrate and component attach, rework and repair.