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Form of workSummary
Apple's Hardware Engineering group is looking for an electronic Packaging Engineer to work on a broad range of MEMS sensor modules. The candidate should have a consistent record of new module development and scaling to mass volume manufacturing.
Key Qualifications
MEMS semiconductor or packaging/assembly experience, with a process engineering skills, developing various semiconductor packaging related processes,(Substrate and lead frame packaging, wire bond, flip chip, precision dispensing, lamination, molding, and thinning).
Experience in MEMS sensor and package interaction.
Candidate should be proficient in a detailed approach to module development, able to collaborate on DFM and FMEA exercises with the multi-functional team.
Experience working with and optimally influencing external suppliers.
Experience working with remote teams to manage process development activities.
Good written and verbal communication skills a must.
Description
The position is responsible for developing processes, materials and equipment for novel sensor packaging to integrate with various Apple products. In this role, there is a variety of functions.
- For Custom modules, you will work with our internal sensing hardware team on design DFM, and our manufacturing partners on key process and materials to enable the design.
- For 3rd party designs, work with our internal design team and the supplier to insure robust capability to produce the module to specification, and troubleshoot technical issues that arise.
- Work with operations team to insure smooth transition from engineering to MP, and external suppliers to develop and deploy new packaging technologies.
Key activities include package development technical collaboration with design and manufacturing, multi-functional team communication, executive reporting, and priority alignment with internal teams.
Education & Experience
BS and a minimum of 10 years relevant industry experience in Optics, Physics, Opto-mechanics, Electrical Engineering, or related fields.
Apple's Hardware Engineering group is looking for an electronic Packaging Engineer to work on a broad range of MEMS sensor modules. The candidate should have a consistent record of new module development and scaling to mass volume manufacturing.
Key Qualifications
MEMS semiconductor or packaging/assembly experience, with a process engineering skills, developing various semiconductor packaging related processes,(Substrate and lead frame packaging, wire bond, flip chip, precision dispensing, lamination, molding, and thinning).
Experience in MEMS sensor and package interaction.
Candidate should be proficient in a detailed approach to module development, able to collaborate on DFM and FMEA exercises with the multi-functional team.
Experience working with and optimally influencing external suppliers.
Experience working with remote teams to manage process development activities.
Good written and verbal communication skills a must.
Description
The position is responsible for developing processes, materials and equipment for novel sensor packaging to integrate with various Apple products. In this role, there is a variety of functions.
- For Custom modules, you will work with our internal sensing hardware team on design DFM, and our manufacturing partners on key process and materials to enable the design.
- For 3rd party designs, work with our internal design team and the supplier to insure robust capability to produce the module to specification, and troubleshoot technical issues that arise.
- Work with operations team to insure smooth transition from engineering to MP, and external suppliers to develop and deploy new packaging technologies.
Key activities include package development technical collaboration with design and manufacturing, multi-functional team communication, executive reporting, and priority alignment with internal teams.
Education & Experience
BS and a minimum of 10 years relevant industry experience in Optics, Physics, Opto-mechanics, Electrical Engineering, or related fields.
