Staff Packaging Engineer (Semiconductor)

Job Description:

1. Spearheaded the establishment of substrate/package design rules, process flow, and material specifications for cutting-edge automotive power module packages.

2. Facilitated seamless alignment between module substrate (PCB) design prerequisites and supplier capabilities, fostering the advancement of new product development and the streamlined manufacturing of power modules at scale.

3. Pioneered the development of innovative assembly technologies, conducted process Design of Experiments (DOE), and delineated precise process windows for the evolution of novel package designs.

4. Led the charge in conducting reliability testing and qualification processes for emerging automotive module packages, collaborating closely with the reliability group to ensure robust outcomes.

5. Engaged in a collaborative effort with offshore assembly and substrate partners, actively contributing to the formulation and refinement of novel processes.

6. Collaborated closely with IC design teams, playing a pivotal role in defining package design rules and configuring packages to impeccably meet their specific requirements.

7. Fostered extensive collaboration with multi-functional teams, ensuring the seamless development, qualification, and production ramp-up of innovative module products.

Job Requirements:

1. Possess a Bachelor's degree in Electrical Engineering, Mechanical Engineering, or Material Science.

2. Accumulate a minimum of 12 years of hands-on experience in semiconductor packaging technology.

3. Demonstrate expertise in leading the development of multi-die packages.

4. Exhibit a comprehensive understanding of organic laminate technologies manufacturing and supplier capabilities.

5. Preferably, have experience in Surface Mount Technology (SMT) or passive integrated package assembly.

6. Showcase proficiency in various packaging processes, including Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation, with a preference for experience in Flip Chip technology.

7. Demonstrate familiarity with package substrate design rules and tools, including AutoCAD.

8. Possess knowledge of Automotive Electronics Council (AEQ) reliability requirements.

9. Display expertise in the Advanced Product Quality Planning (APQP) automotive development process.

10. Familiarity with JEDEC/IPC design standards is essential.

11. Ability to configure Design Rule Checks for the thorough verification of every aspect of PCB layout is a valuable asset.

12. Willingness and ability to travel to Asia for technology reviews and to address subcontractor/supplier issues.

Job Type: Full-time

Salary: $85,915.68 - $193,631.92 per year

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Health insurance
• Life insurance
• Paid time off
• Vision insurance

Schedule:

• 8 hour shift

Work Location: On the road