Principal Package Engineer

Marvell Semiconductor, a global leader in the development and production of high-performance semiconductor technology, is seeking a seasoned Principal Packaging Engineer to join our team in Santa Clara, CA. This role is pivotal for driving innovation and excellence in our packaging engineering processes and outcomes. The successful candidate will have a deep technical background in semiconductor packaging technologies, combined with proven experience in leading and managing a team of engineers.

• Potentially lead a team of 3 Package Engineers, setting high standards for execution and innovation, while fostering a collaborative and results-driven environment.
• Strategically manage the development and implementation of advanced packaging technologies to enhance product performance and reliability.
• Provide technical leadership in the design, simulation, and analysis of semiconductor packages to ensure optimal thermal, mechanical, and electrical performance.
• Work closely with cross-functional teams (R&D, design, manufacturing, quality, and supply chain) to ensure seamless integration and alignment of packaging strategies with company goals.
• Drive continuous improvement initiatives in packaging processes, tools, and methodologies to reduce cost, improve quality, and enhance yield.
• Manage the team's project portfolio, prioritizing tasks and allocating resources to meet deadlines and business objectives efficiently.
• Mentor and develop team members, enhancing their skills and career progression through targeted training and challenging project assignments.
• Stay abreast of industry trends, technological advancements, and competitive strategies in semiconductor packaging to ensure Marvell remains at the cutting edge.
• Lead troubleshooting and problem-solving efforts related to packaging design and process issues, implementing robust solutions to prevent recurrence.
• Contribute to the intellectual property portfolio of the company through innovation and patent generation in the field of semiconductor packaging.

• Bachelor’s degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical field; advanced degree (MS or PhD) preferred.
• Minimum of 10 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.
• At least 5 years of experience in a leadership or management role, with a proven track record of building, leading, and mentoring a high-performing engineering team.
• Strong project management skills, with the ability to lead complex projects across cross-functional teams.
• Excellent analytical and problem-solving skills, with a strong focus on results and a commitment to quality.
• Exceptional communication and interpersonal skills, capable of fostering strong internal and external relationships.
• Demonstrated ability to operate effectively in a fast-paced, dynamic environment, adapting to evolving business and technical challenges.
• Familiarity with relevant industry standards and regulatory requirements related to semiconductor packaging.

130,650 - 195,700, $ per annum At Marvell, we offer a total compensation package with a base, bonus and equity.Health and financial wellbeing are part of the package. That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer. Have a question about our benefits packages - health or financial? Ask your recruiter during the interview process. This role is eligible for our hybrid work model in which you will be able to split time between working from home and on-site in a Marvell office.