R&D Firmware Engineer

Are you looking for an exciting career in the semiconductor industry? Semiconductors are the key evolving components in the industry today. HORIBA has kept its sights keenly focused on this micro world and provides rewarding careers in Sales and Marketing, Research and Development, Production, and Operations.

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The HORIBA Group of worldwide companies provides an extensive array of instruments and systems for applications ranging from automotive R&D, process and environmental monitoring, in-vitro medical diagnostics, semiconductor manufacturing and metrology, to a broad range of scientific R&D and QC measurements. Proven quality and trustworthy performance have established widespread confidence in the HORIBA Brand.

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Our North American Semiconductor group is searching for an experiencedFirmware Engineer to design, write, maintain, test, and install firmware and software to meet customer specifications. Develops firmware in C/C++ for new products and maintains code for legacy products at our HORIBA Semiconductor US R&D Technology Center in Reno, Nevada is just minutes from the Sierra Nevada Mountain range. Discover more about this area by visiting https://www.visitrenotahoe.com.

In this exciting role, you will:

1. Develop firmware in C/C++ for new products and maintains code for legacy products.
2. Assist in preparing functional specifications and schedule estimates in response to project/quote requests.
3. Prepare operator manuals and/ or other documentation supplied in conjunction with a software project.
4. Improve product features and quality, reducing product development costs and product delivery cycle time.
5. Works closely with multi-disciplinary teams locally and offsite in Japan.
6. Provide post-delivery customer support.

You will bring the following skills and knowledge:

1. A bachelor’s degree in computer science, or equivalent experience.
2. 2+ years of experience developing embedded firmware in C / C++.
3. Experience with real-time operating systems, preferably TI RTOS / SYSBIOS.
4. Experience writing MCU/MPU peripheral drivers (SPI, I2C, ADC, CAN, etc.)
5. Understanding of Object-Oriented Design techniques highly desired.
6. Hands-on experience with hardware/software integration:
   1. Oscilloscopes, logic analyzers, emulators.
   2. Ability to read/critique electrical schematics and device datasheets.
7. Experience with embedded Linux development desired.
8. Experience working with analog and digital sensors and actuators.

Compensation Package:

HORIBA Instruments offers a competitive compensation package that includes a 401(k) plan with match; employee group dental, vision, life, and disability (short and long-term) paid for by the company; medical insurance, family dental and vision insurance, and supplemental life insurance available with reasonable employee contributions; employee assistance program; paid holidays, vacation, and sick time; flexible spending accounts; and educational reimbursement and commuter benefit programs.

To Apply

Please upload your resume and a letter of interest.

If you are an individual with a disability and need an accommodation during the application/hiring process, please email semiconductorjobs.us@horiba.com or call (800) 446-7422 ext. 7528 for assistance. HORIBA will provide reasonable accommodations, upon request, to support individuals with disabilities to be able to participate in the hiring process. HORIBA is committed to making our workplace accessible for individuals with disabilities.

EEO/Affirmative Action/Veteran Status/Disabilities.