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Form of workMinimum qualifications:
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, a related field, or equivalent practical experience.
- 8 years of experience in the semiconductor industry working on vendor management, product packaging development, new product introduction, and mass volume production.
- 5 years of experience with IC qualification, data review, production release, system level testing, test time reduction, and yield improvement.
- Experience with IC testing, yield, and bin pareto analysis.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
- Experience with SERDES, PCIe, DDR, and Mixed-Signal circuits such as ADC, DAC, PLL, LDO, and their performance measurements.
- Experience with advanced packaging such as 2.5D.
- Experience with system level testing.
- Familiarity with Design for test (DFT) techniques and structural tests such as Scan/ATPG, JTAG, memory BIST, and testing sensors such as PVT sensors, Temp sensors, etc.
- Familiarity with Automatic Test Equipment (ATE) test platforms such as Advantest 93K, Teradyne UltraFlex SoC test system.
About the job
Our computational challenges are so big, complex and unique we can't just purchase off-the-shelf hardware, we've got to make it ourselves. Your team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Hardware Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of Google users.
As a Product Engineer, you will help develop and deploy a comprehensive test solution using Automatic Test Equipment (ATE) for high volume manufacturing at fabrications, Outsourced Semiconductor Assembly and Tests (OSATs), etc. You'll help integrate SoC technologies into devices and facilitate ATE manufacturing testing of SoC to validate performance and screen out devices. You will own all aspects of testing and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high-quality SoCs.
In this role, you will have a strong understanding of IC flows, wafer processing, testing, qualification, and failure analysis. You will work with various groups to develop digital and mixed signal tests, automation methodologies ,develop/support internal tools for test program generation, vector tracking, test program release, etc. You will also work on releasing cost effective production test solutions into mass production.
Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Develop ATE test programs on UFLEX, 93K, or other ATE platforms. Design an ATE loadboard or probe card for NPI on UFLEX, 93K, or other ATE platforms.
- Develop a benchtop and high-volume manufacturing SLT solution working with SLT Vendor and internal cross-functional teams.
- Trouble-shoot on different failure modes and test coverage improvement on ATE. IC Product bring-up, verification, and characterization on ATE NPI production program release.
- Manage new product defective parts per million (DPPM) correlation, and product correlation between system and ATE.
- Support production sustaining including production program upgrade and release, lot disposition, extended test time reduction and yield improvement, RMA analysis, etc.
