Principal Mechanical Engineer

JOB RESPONSIBILITIES-

Principal Mechanical Engineer

Full-Time

Principal Mechanical Engineer candidates will have the following job responsibilities:

• Our packaging engineers leverage state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies including technologies such as System in Package (SiP), Multichip Module (MCM), Chip-on-board (COB) and high density interconnect PCBs.
• Develop solutions to complex, customer-driven problems with limited direction - drive ideation activities for initial system conceptualization, develop system requirements, propose ways forward when customer requirement are unclear or incomplete, and build and test prototype hardware
• Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, and test
• Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles
• Communicate effectively and openly with multi-disciplinary program team members and program leadership, senior management, and sponsors
• Lead technical teams of 6 or more people to accomplish program goals, developing time/budgetary estimates, and mentoring junior engineers
• Identify, manage and control technical and schedule risks associated with a design decision and communicate them to project leadership and customers or stakeholders
• Produce or oversee the production of fully released Technical Data Packages
• Strong organization, planning and time management skills to achieve program goals

JOB QUALIFICATIONS-

Principal Mechanical Engineer

Full-Time

Principal Mechanical Engineer candidates must meet the following minimum job qualifications:

Required Qualifications:

• Bachelor of Science degree with 15+ years of experience in a relevant field such as MECHANICAL ENGINEERing, materials science, or manufacturing engineering
• Master of Science degree with 10+ years of experience in a relevant field such as MECHANICAL ENGINEERing, materials science, or manufacturing engineering
• Team player able to work in a fast paced environment with demonstrated ability to handle multiple competing tasks and demands
• Experience designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
• Experience with 3D CAD, specifically CREO and/or Solidworks
• Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles
• Experience with fabrication and assembly of prototypes and proof-of-concept models

Preferred Qualifications:

• Experience with machine shop tools and processes, prototyping, and vendor coordination
• Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high-density substrates, rigid-flex designs, and integrated circuit assembly

Security Clearance:

• Current in-scope TOP SECRET security clearance is required.