Job Description
Job Summary
Under minimal supervision, the ideal candidate will have a broad technical background to produces PCB layouts, assembly, detail drawings and other documentation for electronic components, microelectronic circuit assembly and other types of power electronic assemblies to specified dimensions per, engineering requirements.
Primary Responsibilities
Perform multi-layer PCB layouts from schematics, through to post processing, along
with associated Fabrication and Assembly drawings
Interact with PCB manufacturers for procuring prototype boards.
Manage schematic symbol and PCB footprint libraries.
Design concept drawing and 3D models
Package design of the Power Electronic assemblies
Provide engineering documents and prototype models
Develop full documentation packages per work instructions and project specifications
Ability to work in a close Team environment
Maintain good working rapport with PCB Suppliers
Work with all phases of a product life-cycle (Concept to Retirement)
Adhere to ISO work instructions and other company policies
Possess functional knowledge of IPC guidelines
Actively participates in Lean and 6s initiatives
Maintain the highest ethical standards
Performs other duties as required
Basic Qualifications
Minimum 7 years of experience in PCB packaging design and processes
Minimum 2 years of experience in PCB layout using Altium Designer
Minimum 3 year of experience in Inventor
Experience with high-speed digital designs, RF circuits, power supplies, analog
circuits and sensing signals
Experience with Combined Rigid/Flex PCB design
Experience with Various Connector Technologies and Applications
Comprehensive knowledge of IPC PCB Design Standards
Excellent computer skills
Experience with Document Control Practices and Configuration Management
Excellent understanding of geometric tolerance and knowledge of ANSI Y14.5
dimensioning standards
Must have excellent written and verbal communication skills
Must be well organized, detail oriented and have the ability to multi-task
Preferred Qualifications
A Bachelor’s Degree from a four-year college or University in Electronic Technology, Electrical Engineering discipline or equivalent Experience with PCB Heat sinking Techniques and Thermal Management
Strong background in Power Electronics Packaging
Possess mechanical structures and mechanical interfaces experience
Familiar with dielectric design principles and use of design rules
Possess design of injection mold technology
Minimum of two year experience in Aerospace industry