Address
Form of workJob Details:
Job Description:
Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).
Qualifications:
Minimum Qualifications:
Candidate must possess at a minimum a Bachelor of Science degree in a related science or engineering field with 7 years of Process Engineering experience in semiconductor wafer fabrication. Or masters degree with 5 year experience, or PhD degree with 4 year experience.
Ideal candidate will have a minimum of 5 years of Process Engineering experience in any of the following :
Process flow, equipment troubleshooting.
Interacting with vendor field service engineering support and manufacturing/engineering technicians on toolsets.
Providing technical direction on quality issues.
Advanced data analysis.
Knowledge of Thin Film equipment, including recipe development and defect troubleshooting techniques
Developing novel inline detection techniques to help predict end of line failures based on advanced understanding of semiconductor process flow as well as end of line Sort bin failure modes, Etest and Failure analysis techniques.
Preferred Qualifications:
Technical expertise within Semiconductor Processing Engineering and be able to provide technical direction on quality issues, matching performance and yield improvement issues.
Understanding of Thin Films manufacturing process steps and ability to understand interactions with incoming and outgoing process modules.
Knowledge of Thin Films processes and equipment configurations on ASM/AMAT/LAM/Endura platforms
Knowledge of Manufacturing science, Capacity Metrics, In-line and EOL defect and excursion prevention/response
Experience in leading senior, cross function/cross organization teams
Experience in Data analysis (JMP, SPC, MATLAB, Mathematica) and Design of Experiment (DOE) principles
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence.
Job Description:
Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).
Qualifications:
Minimum Qualifications:
Candidate must possess at a minimum a Bachelor of Science degree in a related science or engineering field with 7 years of Process Engineering experience in semiconductor wafer fabrication. Or masters degree with 5 year experience, or PhD degree with 4 year experience.
Ideal candidate will have a minimum of 5 years of Process Engineering experience in any of the following :
Process flow, equipment troubleshooting.
Interacting with vendor field service engineering support and manufacturing/engineering technicians on toolsets.
Providing technical direction on quality issues.
Advanced data analysis.
Knowledge of Thin Film equipment, including recipe development and defect troubleshooting techniques
Developing novel inline detection techniques to help predict end of line failures based on advanced understanding of semiconductor process flow as well as end of line Sort bin failure modes, Etest and Failure analysis techniques.
Preferred Qualifications:
Technical expertise within Semiconductor Processing Engineering and be able to provide technical direction on quality issues, matching performance and yield improvement issues.
Understanding of Thin Films manufacturing process steps and ability to understand interactions with incoming and outgoing process modules.
Knowledge of Thin Films processes and equipment configurations on ASM/AMAT/LAM/Endura platforms
Knowledge of Manufacturing science, Capacity Metrics, In-line and EOL defect and excursion prevention/response
Experience in leading senior, cross function/cross organization teams
Experience in Data analysis (JMP, SPC, MATLAB, Mathematica) and Design of Experiment (DOE) principles
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence.
