Company

Vicor CorporationSee more

addressAddressAndover, MA
type Form of workFull-Time
CategoryInformation Technology

Job description

Job Summary

 

As a NPI Packaging Engineer, you will be responsible for taking Vicor advanced products through various stages of new product introduction (NPI) development by working cross functionally across multiple teams. In addition to early involvement with product design team on design for manufacturability, you will also be evaluating manufacturing processes by designing and conducting research programs; applying knowledge of product design, fabrication, assembly, tooling, and materials; and conferring with manufacturing capabilities, manufacturing engineering staff and as needed equipment vendors.

 

You will work with the most advanced Vicor products involved with development, qualification and production release of electronic assemblies and related assembly processes used in commercial, automotive and other specialty products.
 

Job Description

•    Will work NPI products that are designed and built using our in house highly automated lines working with technologies such as multi-layer high density pcb designs, leading edge SMT assembly, advanced packaging magnetics assembly, thermal transfer molding, state of the art pcb processing/plating fabrication, laser marking, singulation, and test.
•    Works closely with Mechanical and PCB layout groups.  Participates early on in product development design reviews providing feedback on manufacturability and helps incorporate latest technology advancements and design rules.  
•    Develops approaches and plans on with how to assemble and build new products.  Works closely with the Manufacturing Engineering and Process Engineering teams on what is needed to execute the new design builds. 
•    Propose and manage design of experiments to develop and verify process improvements while identifying and developing new processes and equipment required for successful introduction of new products.
•    Interfaces with Quality, Reliability, and Analytical testing lab for NPI efforts. Investigate problems, determine root cause, and implement corrective and preventative actions
•    Works closely with Program Management, Planning, Manufacturing, and Quality to insure NPI effort is tracking, progressing and meeting customer shipments and expectations.
•    Working knowledge and use of SPC data to ensure the highest yields, throughput, and lowest cost. Team will be using Six Sigma tools such as PFMEAs to implement meaningful process controls.
•    Writes technical reports and prepares presentations for peer review covering process development activities and next generation processing methods to supporting technologies that our customers use in application such as cloud servers, autonomous vehicles, military and industrial equipment.
•    Supports the organizational goal of Automotive Readiness in preparation for IATF 16949 Certification. 
•    Initiate and approve manufacturing documentation and ECO’s
 

Education / Qualifications

•    Bachelor's Degree in Mechanical, Chemical, Materials Science, Industrial or Manufacturing Engineering.  Master’s degree is a plus. 
•    5-10 years’ experience with electronics packaging and/or a manufacturing.  
•    Strong fundamental knowledge and ability to analyze high volume, high density SMT processes.  Skills include sound understanding of Solder Stencil Printing, Pick and Place, SPI, AOI, reflow and pcb cleaning.
•    As an NPI Packaging Engineer familiarity with PCB reviews tools such as Altium, GC-CAM EDIT, to help provide feedback on pcb designs would we be a desirable.  OJT training available for candidate.
•    Basic abilities using design based software systems for review and small modifications.  Examples include Solid Works, or Auto CAD.  
•    Experience with the Automotive Requirements such as IATF 16949 Certification, PPAP, BIQ, FTQ is beneficial but our in house Automotive team help train the right candidate.
•    Familiarity with advanced packaging and processing strategies for system in a package devices (SIP) incorporating high layer count laminate (PCB) and ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, transfer molding and encapsulation a plus.
•    Ability to understand/create tolerance stack ups for assemblies and part level.
•    Solid understanding of Design of Experiments (DOE), GD&T, SPC techniques.
•    Basic understanding statistical software tools such as Minitab.  Green Belt/Black Belt certification is a plus.
•    Appreciation for materials interactions and selections for best product designs.
•    Good hands on engineering skills and previous experience working on production equipment or designing products. 
•    Excellent writing, organizational skills as related to project management.

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability or protected veteran status.

Vicor is an EO employer – M/F/Veteran/Disability
 

Refer code: 6907793. Vicor Corporation - The previous day - 2023-12-12 06:55

Vicor Corporation

Andover, MA
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