Semiconductor Packaging Engineer

Responsibilities

When you work at Daktronics, you'll be part of something amazing. We design, engineer, manufacture and support bold, eye-catching digital LED and LCD video displays and audio systems.

 

Our products bring excitement to professional, college and high school games. They attract customers for businesses around the world, and even provide direction for people as they travel, work and play.

 

As part of the Daktronics team, you'll have interesting, impactful work with flexible opportunities. You can learn and grow at a company that provides competitive compensation and meaningful benefits - and the people are second to none.

 

Learn more About Daktronics!

 

Location: 

Preferred that position is located in the Brookings, SD or Sioux Falls, SD area. Depending on a specific candidate's experience and fit, there could be flexibility in remote work from a U.S. home office with periodic travel to Brookings, SD. This position is open to open to candidates eligible to work in the U.S. 

 

Mission: 

Further Daktronics' efforts in MicroLED, MicroIC, and MiniLED technology areas, creating a foundation for bringing those technologies into Solutions to better serve Daktronics' customers. 

 

The position focuses on both the internal development and implementation of MicroLED, MicroIC, and MiniLED technologies as well as identifying and working with external partners in developing the knowledge and ecosystem to support the technologies into production. 

 

Responsibilities: 

• Develop and maintain technical expertise on advances and innovation inLED,IC, wafer level packaging, and flip chip interconnects. 
• Participate in packagingLED roadmap development and execution. 
• Identify, benchmark, and select suitable materials and processes forLED andIC devices. 
• Be connected with Product and Process Engineering, while advancing your understanding of how the external ecosystem is evolving and can integrate with Daktronics. 
• Benchmark, select and qualify suitable materials, processes, and assembly subcontractors (OSAT) or contract manufacturers (CM). 
• Work with OSAT/CM to develop, run DOE to optimize processes, and establish process spec. 
• Develop and establish production controls and monitoring to quality control ofLED parts and processes. 
• Apply various problem-solving methodologies to attack and see problems from various angles, including aspects of product and process design, manufacturability, sourcing, qualification, ongoing supplier quality monitoring/improvement, and product reliability.  
• Establish & maintain package design rules. 

Qualifications

• Minimum 4-year bachelor's degree in Mechanical Engineering, Electrical Engineering, Material Science, Material Engineering, Applied Physics, Optical Science, Applied Chemistry, or related fields. 
• Preferred:  
  • Experiences in semiconductor fabrication emphasizing wafer level and flip-chip packaging. 
  • Strong understanding of wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC, and statistical analysis software. 
  • Knowledge of various mass transfer technologies, processes, and equipment. 
  • Understanding of multidisciplinary interactions between packaging technology, chip package electrical design, thermal, mechanical performance, and reliability. 
• Knowledge of wire-bonding, multi-chip module, CoB, and LED technologies a plus. 
• Familiarity and experiences applying various problem-solving methodologies:  A3 thinking, 5 why, 8D, Ishikawa, etc. 
• Strong interpersonal and communication skills. 
• Experienced analytical and presentation skills. 
• Effectively exercise discretion and independent judgment. 
• Fluent in English, both written and verbal.
• Ability to travel by air and ground. Valid driver's license and good driving record. Motor vehicle records will be checked.
• Applicants must be 18 years of age or older.
• Daktronics does not sponsor, renew, or extend immigration visas for this position.

Daktronics is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, creed, religion, color, national origin, sex, age, disability, genetics, marital status, sexual orientation, gender identity, protected veteran status or citizenship status. If you would like more information on your EEO rights under the law, please click here.

Employment Type: FULL_TIME