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Job Description:
Intel's pursuit of Moore's law drives constant state of the art innovations in Process and Packaging areas. Intel and the industry are entering the era of advanced packaging and Intel has brought in breakthrough advances in packaging through EMIB and Foveros technologies as announced in 2021. To further advance heterogenous integrated packaging capability over the next decade we are putting together a dedicated team, tooling and FAB to drive wafer level assembly technology development (WATD) in the Ronler campus in Oregon. Intel WATD at Intel Hillsboro is a technology development organization to develop future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.
Responsibilities included but not limited to the followings:
Qualifications:
This position is not eligible for Intel immigration sponsorship.
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
Preferred Qualifications:
1+ years of experience with one or more of the following:
Job Type:
College Grad
Shift:
Shift 5 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence.
Job Description:
Intel's pursuit of Moore's law drives constant state of the art innovations in Process and Packaging areas. Intel and the industry are entering the era of advanced packaging and Intel has brought in breakthrough advances in packaging through EMIB and Foveros technologies as announced in 2021. To further advance heterogenous integrated packaging capability over the next decade we are putting together a dedicated team, tooling and FAB to drive wafer level assembly technology development (WATD) in the Ronler campus in Oregon. Intel WATD at Intel Hillsboro is a technology development organization to develop future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.
Responsibilities included but not limited to the followings:
- Willing to work on a compressed work week (CWW)schedule. Shifts are twelve hours long from 7am to 7pm and rotate from three to four days a week- Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days and Shift 7: (Days Back end) AM-PM; Sun - Tue, Alternating Wednesday days.
- Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
- Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
- Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
- Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
- Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
- Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
- Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
Qualifications:
This position is not eligible for Intel immigration sponsorship.
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
- Must possess a Bachelor's Degree with 1+ year of experience, OR Master's Degree in electrical engineering or mechanical engineering or chemical engineering or physics or a similar Engineering discipline.
- Must be willing to work compressed work week Day Shift.
Preferred Qualifications:
1+ years of experience with one or more of the following:
- Statistical Process Control (SPC)/Design of Experiments (DOE) principles.
- Fabrication floor presence and manufacturing interactions.
- Semiconductor fabrication processes and technology.
Job Type:
College Grad
Shift:
Shift 5 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence.
