Company

3D Glass Solutions, Inc.See more

addressAddressPhoenix, AZ
type Form of workFull-Time
CategoryInformation Technology

Job description

Job Description

This jobs is located in Albuquerque, NM.

The Electronics Packaging Engineer is a goal-oriented, self-motivated individual with effective verbal and written communication skills. The candidate must have a strong technical background in Electrical Engineering; supports customers technical inquiries to enable design wins; authors application notes, training materials, and datasheet applications; and assists customers in developing application circuits, reference designs, and evaluation boards, as needed.


ESSENTIAL DUTIES AND RESPONSIBILITIES
• Analyzes customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products.
• Develops high-level and detailed designs consistent with requirements and specifications.
• Validates designs through various methods of review, testing and analysis.
• Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements.
• Supports Supplier Management with make/buy recommendations and other technical services of limited scope.
• Provides engineering support throughout the lifecycle of the product.
• Investigates emerging technologies to develop concepts for future product designs to meet projected requirements.
• Works under general direction.


BASIC QUALIFICATIONS, EXPERIENCE, SKILLS AND EDUCATION REQUIRED
• Bachelor's and 5 or more years' experience, Master's degree with 3 or more years' experience or PhD degree with experience
• Bachelor, Master or higher degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard
• Experience in Electronic Packaging Design in any of the following disciplines: airborne, space, digital, RF or power mechanical systems
• Experience in mechanical CAD design, stress and structural analysis and test, fatigue analysis, and thermal analysis and test
• Experience in requirements comprehension and translating them into prototype designs
• Experience delivering working products through design, verification, and test
• Experience working in a fast paced and dynamic environment
• Experience working with customers and suppliers
• Experience performing to fixed cost and schedule
• Knowledge of filter and Integrated Passive Device concepts and test techniques
• Knowledge of AWR, ADS, CST and HFSS Simulation Software
• Strong leadership skills
• Ability to work in teams
• Proactive
• General knowledge of digital, RF and power subsystem development
• Airborne and Space knowledge
• Understanding of Printed Circuit Board design
• This position requires the ability to obtain U.S. Security Clearance post-start, for which the U.S. Government requires U.S. Citizenship.

Company Description
3D Glass Solutions (3DGS) is an innovative RF passive device design and manufacturing company that develops and builds novel, high-frequency 3D components in its brand new, state-of-the-art, 40,000 sq. ft. manufacturing facility. Leveraging the unique properties of our patented APEX® glass-ceramic material, 3DGS technology enables performance not possible with traditional 2D components. The result is passive components with superior electrical performance and ultra-low transmission loss at high frequencies ranging from 1 to 200 GHz. Using traditional semiconductor processes, 3DGS produces cost-effective, high-precision, high-volume-scale components that meet the needs of consumer, commercial and mil/aero system designers.
Refer code: 8371723. 3D Glass Solutions, Inc. - The previous day - 2024-02-25 19:01

3D Glass Solutions, Inc.

Phoenix, AZ
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