Summer 2024, Intern: Heat Transfer

RTX Corporation is an Aerospace and Defense company that provides advanced systems and services for commercial, military and government customers worldwide. It comprises three industry-leading businesses – Collins Aerospace Systems, Pratt & Whitney, and Raytheon. Its 185,000 employees enable the company to operate at the edge of known science as they imagine and deliver solutions that push the boundaries in quantum physics, electric propulsion, directed energy, hypersonics, avionics and cybersecurity. The company, formed in 2020 through the combination of Raytheon Company and the United Technologies Corporation aerospace businesses, is headquartered in Arlington, VA.   

To realize our full potential, RTX is committed to creating a company where all employees are respected, valued and supported in the pursuit of their goals. We know companies that embrace diversity in all its forms not only deliver stronger business results, but also become a force for good, fueling stronger business performance and greater opportunity for employees, partners, investors and communities to succeed.

The following position is to join our RTX Corporate, Enterprise Services, Research Center or BBN team:

RTX Research Center (RTRC) develops new technologies that enable the most innovative products in the world. Our researchers serve as expert technical consultants for RTX businesses, lead government-sponsored research programs, and pursue their own creative ideas. From next-generation green aircraft propulsion to advanced mission systems for warfighters, we combine innovation with product application to shape the future.

The next generation of products demands that we cross traditional technical boundaries. If you enjoy leveraging your technical expertise in thermal engineering to work across disciplines and on a range of applications, the Heat Transfer Team is a good fit for you. This position demands strong engineering fundamentals, expertise in analytical and numerical physics-based modeling, and the ability to come to meaningful research conclusions.

Primary Responsibilities

• Develop cooling strategies for electronics with high and/or transient heat fluxes, such as heterogeneous integration, microchannel cooling, passive heat spreaders, jet impingement, and phase change materials.
• Develop and apply high-fidelity and reduced order modeling of single- and two-phase flows with computational fluid dynamics.
• Develop and apply advanced optimization design models including parametric optimization and topology optimization for thermal components such as heat sinks, cold plates, heat exchangers, and integrated flow channels.
• Create and utilize physical test systems in the areas of additively manufactured fluid/thermal coupons, two-phase flow loops, and thermal interface characterization.
• Predict device reliability with thermomechanical modeling.
• Perform thermal experiments and computational analysis.
• Develop cryogenic systems and components including advanced cooling cycles.
• Develop emerging thermal management technologies to enable advancements in areas of additive manufacturing, microelectronics, power electronics, electric machines, aircraft systems, avionics, radar systems, sensor systems, and space systems.

Required Qualifications

• Deep understanding in the areas of Heat Transfer and thermal engineering.
• Analytic modeling and programming skills in common languages.
• Understanding of FEA and CFD modeling.
• Experience working in a research laboratory environment.
• Demonstrated experience in publishing and presenting research.

Education

Candidates must be enrolled in a Master's degree or Ph.D. degree program in the field of Aerospace, Mechanical Engineering, Physics or related STEM field.  A minimum 3.5 GPA is required. Please upload unofficial transcript with your application.

Work Authorization 

• U.S. Person (U.S. citizen or permanent resident) or eligible to obtain necessary export authorizations required.
  https://www.ecfr.gov/current/title-22/chapter-I/subchapter-M/part-120/subpart-C/section-120.62"

Job location:

On-site at our facility in East Hartford, CT.