Engineer Ii 74158

Samsung Austin Semiconductor is one of the most advanced semiconductor manufacturing facilities in the world and an integral part of Central Texas for more than 27 years, driving job generation, economic impact and engagement with the surrounding community.
Samsung Austin Semiconductor serves a global customer base with broad semiconductor process technology offerings that impact everyday life including mobile, graphic, consumer, networking/high performance computing, Internet of Things, RF and automotive. Through successful collaborations with foundry customers and a continuous drive to develop the most cutting-edge technologies, Samsung Austin Semiconductor has become a major player in the foundry market. Samsung Austin Semiconductor's technology portfolio ranges from 65nm to 28nm using planar transistor technology to the more advanced 14nm 3D FinFet technology.
With more than 4,500 employees, Samsung Austin Semiconductor is a premier and growing employer who provides a great place to work, is committed to environmental stewardship and being a good corporate citizen. Our employees are the key to our success and we invest in our people with competitive compensation & benefit packages, career development opportunities and programs that enhance physical, emotional and intellectual well-being. Our employees work at various locations throughout Central Texas including the main plant on East Parmer Lane in northeast Austin, a satellite office near Pflugerville and the construction site in Taylor, Texas. Learn more at semiconductor.samsung.com/us/sas.
Roles and Responsibilities:
Specific Job Duties: Design, develop, test and/or evaluate systems for industrial semiconductor production processes in order to analyze and make recommendations to help improve quality indices for each departments business processes and programs. Drive semiconductor electronic materials process performance improvements to ensure process stability during mass production. Responsible for implementing SPC methodologies to manufacture high quality semiconductor products. Drive fab-wide efforts to improve SPC OCAP effectiveness and associated Quality KPIs. Collaborate with process engineering teams and drive root cause identification. Implement defense lines (inline detection) and develop various monitoring (inline, defect, yield and Reliability) strategies to prevent excursions. Responsible for monitoring inline and defect data post high-risk change points to support various fob goals. Develop data analysis scripts that could be used to identify and improve SPC signal to noise ratio of semiconductor processes. Publish weekly status of Key Quality Performance indices (KPIs) for high volume flagship products. Interact with local expats and QR teams in Korea to bench mark and implement Quality improvement and excursion prevention activities (fob-to-fob matching). Participate in excursion management, risk analysis and impacted material disposition. Understand various fob wide process and equipment change points, help develop risk mitigation plans. (Multiple Openings)
Shift: 1st
Skills and Qualifications:
Education, Training, Certification(s) and Minimum years of experience required
Minimum Requirements:
Minimum Requirements: Master's degree in Industrial Engineering, Mechanical Engineering, Electrical Engineering, Materials Engineering, Chemical Engineering, or closely related degree field, and 24 months of experience in the job offered or closely related engineering role. Alternatively, will accept a Bachelor's degree in Industrial Engineering, Mechanical Engineering, Electrical Engineering, Materials Engineering, Chemical Engineering, or closely related degree field, and 60 months of experience in the job offered or closely related engineering role.
Knowledge, Skills, Abilities, Software, and Tools
Requires 24 months of experience in the following:
1. Defect monitoring, characterization, and root cause analysis;
2. Optimization of equipment and process performance and targeting for product yield enhancement and throughput;
3. Developing continuous improvement procedures (CIPs);
4. Inline/ET/EDS yield correlation;
5. Inline Cp/Cpk calculation and improvement;
6. Process optimizations using design of experiments (DOE) methodologies;
7. Implementing SPC methodologies to monitor semiconductor manufacturing processes;
8. Understanding high volume semiconductor manufacturing process, FAB operation and equipment used;
9. Experience with advanced photo lithography technology, related process & equipment troubleshooting;
10. Fab-to-Fab process bench marking and implementing best known methods;
11. Lead Task force teams to disposition of impacted material and improve quality by reducing scrap; and
12. Working level understanding of various semiconductor process technologies.
If and when you submit an application, you, the applicant, agree to not disclose to Samsung, or induce Samsung to use, any confidential or proprietary information (including trade secrets) belonging to any current or previous employer or other person or entity.