Engineer I - Packaging (Ic Packaging Development)

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
Visit our careers page to see what exciting opportunities and company perks await!
Job Description:

• Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages.
• Work with business unit's IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit's roadmap for new products.
• Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
• Create package design documentation and assembly instructions.
• Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.)

Requirements/Qualifications:

• BS or MS Degree in Electrical or Mechanical Engineering with 0-2 years of experience in semiconductor IC packaging.
• Familiar with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA and WLCSP.
• Good understanding of materials as related to chip packaging interaction.
• Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.).
• Strong project management, communication, and leadership skills.
• Highly motivated and dedicated individual with a strong willingness to learn and grow in multiple disciplines including: manufacturing/quality, materials, electrical, thermal, and mechanical.
• Travel up to 10% is expected.

Preferred Qualifications:

• Knowledge of advanced substrate manufacturing/process.
• Experience with Ansys Electronic Desktop.
• Experience with Cadence APD and AutoCad for custom substrate design.
• Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification.
• Familiarity with failure analysis techniques on package technologies.

Travel Time:
0% - 25%
Physical Attributes:
Feeling, Hearing, Other, Seeing, Talking, Works Alone, Works Around Others
Physical Requirements:
80% Sitting, 10% Walking, 10% Standing, Usual Business Hours
Pay Range:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below:
Benefits of working at Microchip
The annual base salary range for this position, which could be performed in California, is $64,480 - $128,000.*
*Range is dependent on numerous factors including job location, skills and experience.
Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.
For more information on applicable equal employment regulations, please refer to the EEO is the Law Poster and the EEO is the Law Poster Supplement. Please also refer to the Pay Transparency Policy Statement.