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Job Description:
Technical Lead for Physical Designs
Are you a versatile, senior engineer capable of leading external and internal cross-functional teams? Do your colleagues recognize you as a resident expert in areas such as Physical Design, STA, DFT, and packaging? Have you taped out so many chips that you can identify potential design problems hidden in EDA reports, advise design teams on how to fix them, and avoid them in the future, then publish an application brief about it? If this is your engineering profile and you are looking for a challenge, then we have one for you.
Broadcom develops chips for a wide-range of products that keep the globe connected. Our ASIC products division is looking for senior, Physical Design engineering veterans to guide teams designing some of the industry's most advanced chips in areas such as Networking, AI/ML and HPC. In this immensely responsible position you will represent Broadcom in front of our customers whose designs push technology to its limits.
As a valued member of this team, you will be required to do the following:
• Manage external customer ASIC programs from inception to finish, including RFQs, legal, technology and IP collaterals, design, test, packaging, fabrication, bring-up and production.
• Be a primary point of interface between the customer and Broadcom internal engineering teams, and build a strong collaborative relationship with all stakeholders.
• Advise customers on best practices in EDA, flows and design methodologies, and by organizing Q&A sessions with Broadcom technology experts.
• See ahead, plan ahead, work ahead.
• Proactively assess potential risks to the design quality, project schedule, then work with cross-functional teams to prepare and execute risk mitigation actions.
• Diligently organize, prioritize and manage multiple tasks.
• Execute Physical Design flows to check that incoming customer tape-in netlists meet Broadcom's stringent tape-out quality standards.
• Motivate and drive yourself to stay abreast of developments in Broadcom IPs, technology and end user applications.
• Participate in discussions about your chips with marketing, sales, legal and regulatory compliance teams.
• Being a consummate team player, lend your technical expertise to internal engineering teams for critical projects.
You must have these proven skills to qualify for this position:
• Multiple tape-outs in advanced technology nodes (16 FinFet and lower)
• Analyze PPA tradeoffs involved amongst various library components, and architectures.
• Knowledgeable in low power design and power management. Hands-on experience in Physical Design and STA
• Well verse in EDA tools for Physical Design verification and sign-off.
• Knowledge of ASIC design flow including Physical Design, logic simulation, test, and packaging.
• Programming in TCL, shell and scripting languages
Following skills are nice to have but not required:
• Exposure to SERDES communications protocols.
• Logic design, chip architecture, microarchitecture, Verilog RTL coding
• Front-end logic design verification, DRC, logic synthesis
• Knowledge of DFT methods including scan, boundary scan, memory BIST and test and repair.
Education and Experience required:
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $126,000 - $210,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
Technical Lead for Physical Designs
Are you a versatile, senior engineer capable of leading external and internal cross-functional teams? Do your colleagues recognize you as a resident expert in areas such as Physical Design, STA, DFT, and packaging? Have you taped out so many chips that you can identify potential design problems hidden in EDA reports, advise design teams on how to fix them, and avoid them in the future, then publish an application brief about it? If this is your engineering profile and you are looking for a challenge, then we have one for you.
Broadcom develops chips for a wide-range of products that keep the globe connected. Our ASIC products division is looking for senior, Physical Design engineering veterans to guide teams designing some of the industry's most advanced chips in areas such as Networking, AI/ML and HPC. In this immensely responsible position you will represent Broadcom in front of our customers whose designs push technology to its limits.
As a valued member of this team, you will be required to do the following:
• Manage external customer ASIC programs from inception to finish, including RFQs, legal, technology and IP collaterals, design, test, packaging, fabrication, bring-up and production.
• Be a primary point of interface between the customer and Broadcom internal engineering teams, and build a strong collaborative relationship with all stakeholders.
• Advise customers on best practices in EDA, flows and design methodologies, and by organizing Q&A sessions with Broadcom technology experts.
• See ahead, plan ahead, work ahead.
• Proactively assess potential risks to the design quality, project schedule, then work with cross-functional teams to prepare and execute risk mitigation actions.
• Diligently organize, prioritize and manage multiple tasks.
• Execute Physical Design flows to check that incoming customer tape-in netlists meet Broadcom's stringent tape-out quality standards.
• Motivate and drive yourself to stay abreast of developments in Broadcom IPs, technology and end user applications.
• Participate in discussions about your chips with marketing, sales, legal and regulatory compliance teams.
• Being a consummate team player, lend your technical expertise to internal engineering teams for critical projects.
You must have these proven skills to qualify for this position:
• Multiple tape-outs in advanced technology nodes (16 FinFet and lower)
• Analyze PPA tradeoffs involved amongst various library components, and architectures.
• Knowledgeable in low power design and power management. Hands-on experience in Physical Design and STA
• Well verse in EDA tools for Physical Design verification and sign-off.
• Knowledge of ASIC design flow including Physical Design, logic simulation, test, and packaging.
• Programming in TCL, shell and scripting languages
Following skills are nice to have but not required:
• Exposure to SERDES communications protocols.
• Logic design, chip architecture, microarchitecture, Verilog RTL coding
• Front-end logic design verification, DRC, logic synthesis
• Knowledge of DFT methods including scan, boundary scan, memory BIST and test and repair.
Education and Experience required:
- BS in Electrical Engineering and 12+ years related experience or MS in Electrical Engineering and 10+ years related experience.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $126,000 - $210,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
