Company

HardwareSee more

addressAddressCupertino, CA
CategoryInformation Technology

Job description

- Definition and trade-off studies of camera/depth optics, sensors, actuator, and packaging. - Interaction with optical, electrical, process, controls systems, sensing, test, and mechanical teams on integration of camera hardware into products. - Leadership of offshore manufacturing partners on camera design evaluation, product prototype builds, and qualification. - Leadership of failure analysis and corrective action implementation at manufacturing sites as well as remotely, including assembly processes, testing, and calibration; parametric-data analysis of end-of-line yield and post-reliability failures. - Evaluation and debugging of camera HW at module and product levels for Camera/Depth Design and Integration. - Documentation of camera-specific design, test, and manufacturing requirements. - International travel may be required to supplier facilities for product development and production bring-up.

Request

  • This role requires the ability to learn quickly and become familiar with several different technology areas. At least 2+ years relevant experience in camera/depth technology or related electronics industry.
  • Ability to lead a multi-functional team of engineers and scientists with unique background and technical expertise through the R&D phase of product development from concept to mass production is a key requirement.
  • Ability to influence other teams, manage risk, make decisions with limited amount of information, deliver against a fast-paced development schedule are key requirements.
  • Able to communicate and convey ideas clearly and concisely.
  • The applicant will also be familiar with at least 3 of the skills listed below:
  • Design and tolerance analysis of highly constrained, high-volume actuators or translational mechanisms.
  • Electronic circuit and system design including power and signal integrity.
  • Understanding of geometric optics and image quality evaluation including test charts, algorithms, and lighting.
  • Image/depth sensor design or characterization.
  • Compact module manufacturing processes such as sensor attachment, flex attachment, active alignment, etc.
  • Failure analysis techniques such as optical microscopy, X-ray, CT scans or SEM.
  • Demonstrated ability in root-cause and corrective-action analysis.
  • Proficiency in statistical analysis, data reporting, and visualization.
  • Proven track record of successfully delivering new products into mass production on time, meeting yield and efficiency targets.
Refer code: 8870768. Hardware - The previous day - 2024-04-04 00:00

Hardware

Cupertino, CA
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