Address
Form of workUS CITIZENSHIP REQUIRED FOR THIS POSITION: Yes
RELOCATION ASSISTANCE: Relocation assistance may be available
CLEARANCE TYPE: Secret
TRAVEL: Yes, 10% of the Time
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We're looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we'll support yours of expanding your personal network and developing skills, whether you are new to the field or an industry thought-leader. At Northrop Grumman, you'll have the resources, support, and team to do some of the best work of your career.
Northrop Grumman is seeking Microelectronic Semiconductor Engineers. This position will be located at our Mission Systems Sector in Apopka, FL.
The qualified candidate will become part of Northrop Grumman's Advanced Packaging Technology µ-Line.
Northrop Grumman's semiconductor foundry, packaging, integration, and test lines have unique capabilities of supporting a range of production microelectronics and providing leading-edge technology development.
The Apopka Florida wafer bumping µ-Line will support flip chip, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions. Techniques will include sputter, electro-plating, and solder-sphere transfer to support flip chip, 2.5D, and 3D packaging using 100 mm to 300mm wafers. The devices supported in Apopka will also be subjected to singulation and die/wafer probe testing.
Responsibilities include:
- Support multiple wafer bumping processes.
- Support development and leading the aspects of the qualification of new bump process flows.
- Working with cross-site program, test, and reliability teams to achieve package qualifications and troubleshoot manufacturing and development issues.
- Ability to understand program package requirements and support advisement on suitable bump metallurgies and process flows as applicable.
- Support as required technical interface activities between wafer bumping line, site management, and internal programs.
- Troubleshoots existing processes to improve safety, quality, cost, and efficiency.
- incorporates engineering changes on work in process.
- Research and evaluate commercially available tools and equipment to support manufacturing processes.
- Coordinates with production on day-to-day activities. Assists in the resolution of processing issues.
Basic Qualifications:
This requisition may be filled at either a level 1 or a level 2. Basic qualifications for a Microelectronic Semiconductor Engineer 1 are a Bachelor's Degree. Basic qualifications for a Microelectronic Semiconductor Engineer 2 are a Master's Degree.
- Be completing or has completed their degree (Bachelor's, Master's, or PhD) from an accredited institution.
- Be majoring in or having majored in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics or a closely related STEM degree.
- Be able to obtain a U.S. Government security clearance (U.S. citizenship is a pre-requisite)
- The ability to obtain Special Access Program within a reasonable period of time, as determined by the company to meet its business needs.
- Willingness to have position transition from 1st shift to 2nd Shift in the future.
Preferred Qualifications:
- Have an overall cumulative GPA of 3.0/4.0 or higher
- Experience in a manufacturing environment
- Experience using SPC and Six Sigma techniques.
- Prior experience with semiconductor-industry-capable process tools
- Understanding of UBM and solder bump metallurgy and how they impact package reliability.
- Experience with both lead and lead-free bump technologies.
- Experience in flip-chip, 2.5D, and 3D packaging.
- Knowledge of relevant semiconductor processes, such as electrochemical plating, electroless plating, contact lithography, spin-on resists wet chemical processing and etches, thin film sputter deposition, and solder sphere bump processing.
- Experience in low volume/high product mix environments.
- Personal Clearance Level- Secret
Salary Range
Level 1: $62,200 - $93,400
Level 2: $75,300 - $112,900
For a broader consideration, please consider completing a profile in our campus candidate community. By clicking on the link below your resume will be visible to recruiters and hiring managers across Northrop Grumman with opportunities nationwide for our internship and entry-level positions.
https://northropgrumman.yello.co/app/collect/form/9iuA6_W8E7bMDHTOHUZoWw
campusjobs
Salary Range: $62,200.00 - $93,400.00Salary Range 2: $75,300.00 - $112,900.00
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.
