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Form of work Descripcion
Puesto en Samtec, Inc
Founded in 1976, Samtec is a privately held, $1 Billion global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec's global presence enables its unmatched customer service.
Samtec is seeking a Wire Bond / Process Engineering Technician for our facility in Colorado Springs. This is a day shift position. The hours are Monday through Friday, TBD on day shift.
The hourly range for this position is $20.00 to $25.00 per hour plus applicable bonuses and is commensurate with experience. Standard benefit offerings available are medical (HSA/PPO), dental, vision, group life, AD&D, short and long term disability, PTO, vacation, EAP, 401k, other voluntary options along with a collaborative work environment and supportive company culture.
The Wire Bond / Process Engineering Technician is a self-motivated contributor working primarily with internal customers and suppliers to develop and deliver manufacturable microelectronics packaging solutions for a wide range of semiconductor and optical transceiver products. The job will be very hands-on and involve planning experiments, preparing test samples, creating prototypes, collecting, and documenting test and production data, executing process validation and equipment qualifications, documenting work procedures and assembly methods, and maintaining inventory of engineering materials. The equipment and process responsibilities will primarily be in the Wire Bond area with additional responsibilities across dicing, laser marking and other semiconductor packaging assembly areas.
Key Words: Wire Bonding, Dicing, Laser Marking, Die Bonding, Semiconductor Packaging, Microelectronics Packaging, Optoelectronics Assembly, IC, Process Development
Essential Functions/Responsibilities:
- Develop and optimize advanced packaging processes, materials, and equipment, from initial feasibility through production.
- Adaptation, and development of new and unique processes for specific applications - wafer dicing, Wire Bonding, laser marking, among others.
- Operates with minimum engineering direction in a small company and uses a creative, collaborative, proactive, problem-solving approach on a daily basis.
- Supports technical manufacturing processes, performs equipment set-up and preventative maintenance, material preparation and evaluation, and process and equipment troubleshooting for issue resolution.
- Executes on assigned tasks designed to improve and qualify manufacturing processes.
- Creates, maintains, and improves on equipment and process specific documentation used by manufacturing for process set-up, maintenance, operations and training.
- Supports production needs to meet Customer On-Time-Delivery requirements.
- Runs production as needed or when requested in situations as defined or required by Management.
- Trains operators on assembly processes and equipment in areas of expertise.
The responsibilities as defined are intended to serve as a general guideline for this position. Associates may be asked to perform additional tasks depending on strengths and capabilities.
Required Experience:
- Experience working in a high-tech environmental and/or or direct hands-on experience with semiconductor or IC packaging equipment.
- Experience with Microsoft Applications (Excel, PPT, Word) for data analysis, reports, and documentation.
- Equipment maintenance experiences on semiconductor packaging assembly equipment is a plus.
- Experience with AutoCAD, SolidWorks or other drafting software is a plus.
- Familiarity with clean room floor operating protocols, equipment, and processes.
Preferred Education:
- Technical degree in related field from accredited school; or at least 3 years of equivalent hands-on experience as a Process Technician in a Semiconductor or Commercial electronics clean room setting.
Training required:
- On the job training as appropriate.
